Typical sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system. Each of these compounds presents a critical stabilizing concentration of ca. 10(-5) mol/L, below which the ENP rate is slightly promoted with increasing concentration but above which it is significantly suppressed. Their role in stabilizing the ENP bath was found to involve inhibition of the anodic reaction of hypophosphite. The chemical adsorption of these two amino acids on active nickel sites at the Ni plating surface was studied via their adsorption on an in situ generated Ni powder. In addition, the stabilization mechanism was investigated by using potentiometry, X-ray photoelectron spectroscopy (XPS), and UV-vis/infrared spectroscopy. Finally, the bath stabilizing capabilities of these two amino acids and the change in ENP properties with time were assessed through a continuous operation comprising four metal-turnover (MTO) runs.