A new hybrid cooling scheme is proposed for high-flux thermal management of electronic and power devices. This scheme combines the cooling benefits of micro-channel flow and micro-jet impingement with those of indirect refrigeration cooling. Experiments were performed to assess single-phase cooling performance using HFE 7100 as working fluid. Excellent predictions were achieved using the standard k-epsilon model. The proposed cooling scheme is shown to involve complex interactions of impinging jets with micro-channel flow. Increasing jet velocity allows jets to penetrate the micro-channel flow toward the heated surface, especially in shallow micro-channels, greatly decreasing wall temperature. Despite the relatively poor thermophysical properties of HFE 7100, the proposed cooling scheme facilitated the dissipation of 304.9 W/cm(2) without phase change; further improvement is possible by increasing jet velocity and/or decreasing coolant temperature. In addition to the numerical predictions, a superpositioning technique is introduced that partitions the heat transfer Surface into zones that are each dominated by a different heat transfer mechanism, and assigning a different heat transfer coefficient value to each zone. Using this technique, a new correlation is developed that fits the data with a mean absolute error of 6.04%. (C) 2008 Elsevier Ltd. All rights reserved.