4,4'-Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene-ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon-containing polytriazole resin (PDMSEPE-DAMBP) by 1,3-dipolar cycloaddition. Differential scanning calorimetry, FTIR, and C-13-NMR were used to characterize the curing behaviors of PDMSEPE-DAMBP resins. The results indicated that the resins could cure at temperatures as low as 80 degrees C. Dynamic mechanical analysis showed that there was a glass transition at 302 degrees C for the cured PDMSEPE-DAMBP resin. The carbon fiber (T700) reinforced PDMSEPE-DAMBP composites exhibited excellent mechanical properties at room temperature and high property retention at 250 degrees C. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 114: 1725-1730, 2009