화학공학소재연구정보센터
Journal of Supercritical Fluids, Vol.47, No.2, 309-317, 2008
Analyses of oxide films grown on Alloy 625 in oxidizing supercritical water
Morphologies, microstructures and chemical composition of oxide films grown on Alloy 625 at 400 degrees C, 450 degrees C and 500 degrees C in oxidizing supercritical water containing 2.0% H2O2 were investigated using weight measurement, grazing incidence X-ray diffractometry, scanning electron microscopy, X-ray photoelectron spectroscopy and transmission electron microscopy. It was found that the mass gain of the alloy in oxidizing supercritical water increased with exposure time. The smallest mass gain was obtained at 450 degrees C, agreeing well with the smallest oxide film thickness at this temperature. The average thickness of the oxide films was 1.28 mu m, 0.72 mu m and 1.42 mu m at 400 degrees C, 450 degrees C and 500 degrees C, respectively after 250h exposure. The size of oxide crystals on the alloy surface gradually grew with increasing exposure temperature. A discontinuous and thin Cr2O3 layer was formed at 400 degrees C in oxidizing supercritical water as a result of leaching of Cr3+ as Cr6+, while a continuous Cr2O3 layer was formed at 450 degrees C and 500 degrees C. Duplex oxide layer structure was observed at all three temperatures, which was identified to consist of Ni(OH)(2)/NiO/NiCr2O4/Cr2O3/Alloy 625 from outer to inner layer. The growth mechanism of oxide films on Alloy 625 in oxidizing supercritical water seems to be similar to that in high temperature water, namely the Ni(OH)(2)/NiO outer layer growth by dissolution and precipitation mechanism and the Cr2O3 inner layer formation by oxygen diffusing inward and reacting with the retained Cr. (C) 2008 Elsevier B.V. All rights reserved.