Cold development was applied to improve the resolution in a trilayer resist that is used for the fabrication of state-of-the-art soft x-ray microscopy zone plates. By decreasing the temperature of the hexyl acetate developer to -50 degrees C, 11 nm half-pitch gratings have been resolved in the electron-beam resist ZEP 7000. 12 nm half-pitch gratings have been successfully transferred, via the intermediate SiO2 hardmask, into the bottom polyimide layer by CHF3 and O-2 reactive ion etching. The trilayer resist, including optimized cold development, has finally been used in an electroplating-based process for the fabrication of nickel zone plates. Zone plates with down to 13 nm outermost zone width have been fabricated and 2.4% average groove diffraction efficiency has been measured for zone plates with 15 nm outermost zone width and a nickel height of 55 nm.