A hierarchic strategy for the modeling of secondary current density and etch rate distributions on complex patterned electrodes is proposed. In the framework of this study, it is applied to a printed circuit board (PCB). The strategy circumvents the direct simulation of all geometric details by splitting the overall problem into two different scales. Macroscopic and mesoscopic current density distributions are each computed while accounting for the other scale in a simplified manner. In the mesoscopic step, not only the chosen region but also an additional surrounding region is considered. The latter routine is essential to prevent false distributions at the border of the chosen region. The introduced modeling strategy significantly reduces the number of nodal points necessary for sufficient discretization and hence the allocated memory while yielding current density distributions on any desired place of the workpiece with a high accuracy.