The electroless plating of Cu-Ni-P alloy onto cotton fabrics

Arezoo Afzali; Vahid Mottaghitalab; Mahmood Saberi Motlagh; Akbar Khodaparast Haghi

Korean Journal of Chemical Engineering, Vol.27, No.4, 1145-1149, July, 2010

DOI10.1007/s11814-010-0221-8 Export Citation

The electroless plating of Cu-Ni-P alloy onto cotton fabrics

Arezoo Afzali, Vahid Mottaghitalab, Mahmood Saberi Motlagh¹, and Akbar Khodaparast Haghi^†

University of Guilan, P.O. Box 3756, Rasht, Iran
¹Guilan Science and Ttechnology Park (GSTP), Rasht, Iran

E-mail:

The objective of this study is to apply the electroless plating of Cu-Ni-P alloy on cotton fabrics to the preparation of conductive fabrics. The alloy composed of infinit small amount of nickel and phosphorus particle originated from sodium hypophosphite and nickel sulphate respectively as reducing agent and hypophosphite oxidation accelerator. Electroless plating of Cu-Ni-P alloy on cotton fabrics and effect of plating on the physical and mechanical properties of alloy coated fabrics as well as electromagnetic interference (EMI) shielding effectiveness were reported in detail. In this research highly washing and abrasion durable conductive fabrics obtained with supreme shielding effectiveness.

Keywords:Electroless Plating of Cu-Ni-P Alloy;Cotton Fabric;Surface Morphology

[References]

Guo RH, Jiang SQ, Yuen CWM, Ng MCF, J. Mater. Sci.: Mater Electron, DOI 10.1007/s10854-008-9594-4 (2008)
Lin YM, Yen SC, Appl. Surf. Sci., 178(1-4), 116 (2001)
Xueping G, Yating W, Lei L, Bin S, Wenbin H, J. Alloys Compounds., 455, 308 (2008)
Li J, Hayden H, Kohl PA, Electrochim. Acta, 49(11), 1789 (2004)
Larhzil H, Cisse M, Touir R, Touhami ME, Cherkaoui M, Electrochim. Acta, 53(2), 622 (2007)
Gaudiello JG, Ballard GL, IBM J. RES. DEVELOP., 37(2) (1993)
Xueping G, Yating W, Lei L, Bin S, Wenbin H, Surface & Coatings Technology., 201, 7018 (2007)
Han EG, Kim EA , Oh KW, Synth. Met., 123, 469 (2001)
Jiang SQ, Guo RH, Fibers and Polymers., 9, 755 (2008)
Djokic SS, Fundamental Aspects of Electrometallurgy: Chapter 10, Metal Deposition without an External Current, Eds., Popov KI, Djokic SS Grgur BB, pp. 249-270, Kluwer Academic Publishers New York (2002)
Mallory O, Hajdu BJ, Eds., Electroless Plating: Fundamentals and Applications, Noyes Publication, New York (1990)
Agarwala RC, Agarwala V, Sadhana., 28, 475 (2003)
Paunovic M, Plating., 51, 1161 (1968)
Chang HF, Lin WH, Korean J. Chem. Eng., 15(5), 559 (1998)

[Referenced By]

[1] Guo RH, Jiang SQ, Yuen CWM, Ng MCF, J. Mater. Sci.: Mater Electron, DOI 10.1007/s10854-008-9594-4 (2008)

[2] Lin YM, Yen SC, Appl. Surf. Sci., 178(1-4), 116 (2001)

[3] Xueping G, Yating W, Lei L, Bin S, Wenbin H, J. Alloys Compounds., 455, 308 (2008)

[4] Li J, Hayden H, Kohl PA, Electrochim. Acta, 49(11), 1789 (2004)

[5] Larhzil H, Cisse M, Touir R, Touhami ME, Cherkaoui M, Electrochim. Acta, 53(2), 622 (2007)

[6] Gaudiello JG, Ballard GL, IBM J. RES. DEVELOP., 37(2) (1993)

[7] Xueping G, Yating W, Lei L, Bin S, Wenbin H, Surface & Coatings Technology., 201, 7018 (2007)

[8] Han EG, Kim EA , Oh KW, Synth. Met., 123, 469 (2001)

[9] Jiang SQ, Guo RH, Fibers and Polymers., 9, 755 (2008)

[10] Djokic SS, Fundamental Aspects of Electrometallurgy: Chapter 10, Metal Deposition without an External Current, Eds., Popov KI, Djokic SS Grgur BB, pp. 249-270, Kluwer Academic Publishers New York (2002)

[11] Mallory O, Hajdu BJ, Eds., Electroless Plating: Fundamentals and Applications, Noyes Publication, New York (1990)

[12] Agarwala RC, Agarwala V, Sadhana., 28, 475 (2003)

[13] Paunovic M, Plating., 51, 1161 (1968)

[14] Chang HF, Lin WH, Korean J. Chem. Eng., 15(5), 559 (1998)