유도 결합형 저온 플라즈마 처리에 따른 폴리카보네이트 표면 특성 변화

원동수; 이원규; Dong Su Won; Won Gyu Lee

Korean Chemical Engineering Research, Vol.48, No.3, 355-358, June, 2010

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유도 결합형 저온 플라즈마 처리에 따른 폴리카보네이트 표면 특성 변화

Influence of Inductively Coupled Plasma on Surface Properties of Polycarbonate

원동수, 이원규 ^†

강원대학교 화학공학과, 200-701 강원도 춘천시 강원대학길 1

Dong Su Won, and Won Gyu Lee^†

Department of Chemical Engineering, Kangwon National University, 192-1 Hyoja-dong, Chuncheon-si, Ganwon-do 200-701, Korea

E-mail:

초록

유도 결합 저온 플라즈마를 사용하여 폴리카보네이트 시료를 처리한 후 표면 특성 변화를 분석하였다. 표면 거칠기는 플라즈마 공정조건에 상관없이 표면 처리 후에 모두 증가하였으나, 산소 분위기에서 플라즈마 처리했을 때 가장 크게 증가하였다. 표면의 화학 결합 분석에서 플라즈마 처리 전 시료의 산소 함량이 산소 플라즈마 처리 후에 43% 증가하여 표면에 친수성 극성기의 형성이 촉진되었다. 공정 변수 중, 처리 시간에 따른 접촉각 변화는 산소 분위기에서 가장 낮은 접촉각 9.17°을 얻을 수 있었고, 방전 전력의 증가는 같은 처리 시간에서 빠르게 접촉각의 감소를 보여 플라즈마 표면처리 시간을 단축시키는 효과를 주었다. 그러나 방전기체 유량의 증가에 대한 접촉각 변화에 대한 영향성이 크지 않았다.

Inductively coupled low temperature plasmas with oxygen, argon, mixture of oxygen and argon, and nitrogen have been used to modify polycarbonate(PC) films at the various process conditions. All plasma treatments generally had a tendency to increase the surface roughness of PC regardless of process conditions. The treatment of oxygen plasma showed the highest value in the surface roughness and mostly enhanced the generation of oxygen containing polar groups as much as 43% in comparison of untreated PC. The contact angle of untreated PC decreased from 82.31° to the lowest value of 9.17° after oxygen plasma treatment. The increase of RF delivered power had an effect on the rapid reduction of contact angle, but gas flow rates did not effect to reduce contact angles so much.

Keywords:Polycarbonate;Inductively Coupled Plasma;Surface Modification;Contact angle;Surface Roughness

[References]

Kim JT, Lee DC, J. KIEEME, 11, 293 (1998)
Han SH, Lee YH, Kim HD, Kim GH, Surf. Coat. Technol., 93, 261 (1997)
Kang SM, Yoon SG, Jung WS, Yoon DH, J. Korea Ceram. Soc., 43, 38 (2006)
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Jia WT, Chen XF, J. Appl. Polym. Sci., 66(10), 1885 (1997)
Papirer E, Wu DY, Carbon, 28, 393 (1990)
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Kang ET, Tan KL, Kato K, Uyama Y, Ikada Y, Macromolecules, 29(21), 6872 (1996)
Nihlstrand A, Hjertberg T, Johansson K, Polymer, 38(14), 3581 (1997)
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Good RJ, J. Adhesion Sci. Technol., 6, 1269 (1992)
Roth JR, Industrial Plasma Engineering, 1: Principles, Institute of Physics, London (2001)
Roth JR, Industrial Plasma Engineering, 2: Applications to Nonthermal Plasma Processing, Institute of Physics, London (2001)
Khler M, Etching in Microsystem Technology, Wiley-VCH, Weinheim (1999)
Yasuda H, “Plasma Polymerization,” Academic Press, Orlando, FL (1985)
Lee JS, Sin HS, Seok JW, Jang GW, Beag YH, J. Korea Vac. Soc., 18, 1 (2009)
Bae KS, Eom JS, Lee IS, Kim SH, Ko YB, Kim DW, J. Korea. Inst. Surf. Eng., 37, 5 (2004)

[Related Articles]

[1] Kim JT, Lee DC, J. KIEEME, 11, 293 (1998)

[2] Han SH, Lee YH, Kim HD, Kim GH, Surf. Coat. Technol., 93, 261 (1997)

[3] Kang SM, Yoon SG, Jung WS, Yoon DH, J. Korea Ceram. Soc., 43, 38 (2006)

[4] Kim YH, Wool RP, Macromolecules, 16, 1115 (1983)

[5] Jia WT, Chen XF, J. Appl. Polym. Sci., 66(10), 1885 (1997)

[6] Papirer E, Wu DY, Carbon, 28, 393 (1990)

[7] Park SJ, Kim JS, Carbon, 39, 2011 (2001)

[8] Kang ET, Tan KL, Kato K, Uyama Y, Ikada Y, Macromolecules, 29(21), 6872 (1996)

[9] Nihlstrand A, Hjertberg T, Johansson K, Polymer, 38(14), 3581 (1997)

[10] Chen JR, Wakida T, J. Appl. Polym. Sci., 63(13), 1733 (1997)

[11] Good RJ, J. Adhesion Sci. Technol., 6, 1269 (1992)

[12] Roth JR, Industrial Plasma Engineering, 1: Principles, Institute of Physics, London (2001)

[13] Roth JR, Industrial Plasma Engineering, 2: Applications to Nonthermal Plasma Processing, Institute of Physics, London (2001)

[14] Khler M, Etching in Microsystem Technology, Wiley-VCH, Weinheim (1999)

[15] Yasuda H, “Plasma Polymerization,” Academic Press, Orlando, FL (1985)

[16] Lee JS, Sin HS, Seok JW, Jang GW, Beag YH, J. Korea Vac. Soc., 18, 1 (2009)

[17] Bae KS, Eom JS, Lee IS, Kim SH, Ko YB, Kim DW, J. Korea. Inst. Surf. Eng., 37, 5 (2004)