The hot embossing process has so far been developed mainly for replication of surface structures on thermoplastic substrates. Because of the lack of a through-thickness action, fabrication of discrete microparts such as microgears is considered difficult. In this study, embossing molds having multiple microcavities were used in a through-thickness embossing process with a rubber-assisted ejection mechanism. Microparts made of HDPE and ABS with each part weighing approximately 1 and 1.4 mg, respectively, were produced. When in the mold, embossed microparts were intermittently connected to each other through thin residual films of a thickness approximately 20 pm. The residual films were detached from the microparts during a rubber-assisted ejection stage. Because no resin delivery paths, e.g., runners and gates, are needed for microcavities on the multicavity embossing mold, this micropart fabrication process could replace micro injection molding in many applications. POLYM. ENG. SCL, 49:1894-1901, 2009. (C) 2009 Society of Plastics Engineers