A new 0.56 mu m(2) dual-gate EEPROM transistor is presented in this paper. To optimize the cell layout, a new model based on previous work has been developed. This concept allows single bit memory operations with high density; new cell programming conditions has been defined to optimize electrical behavior. Concept has been validated in an EEPROM standard technology from STMicroelectronics and allows a cell area reduction of above 50%. With appropriate potentials, the cell produces a programming window of 4 V. Moreover, this dual-gate transistor in static mode becomes an adjustable threshold voltage transistor which can be used in logic circuit or RFID applications. (C) 2008 Elsevier Ltd. All rights reserved.