Korea-Australia Rheology Journal, Vol.22, No.4, 259-264, December, 2010
Interphase control of boron nitride/epoxy composites for high thermal conductivity
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The effects of the surface treatment of boron nitride (BN) particles on the thermal conductivity of BN/epoxy composite systems was investigated. By coating an amino silane compatibilizer on the BN surface, the interfacial space could be decreased so as to minimize the phonon scattering and thermal-interface resistance. When an excessive amount of silane compatibilizer was present at the BN/epoxy interphase boundary, it acted as a thermal insulation layer, resulting in the reduction of the thermal conductivity. Accordingly, the thermal conductivity was maximized when the optimal amount of silane compatibilizer was used, which was associated with the specific surface area or the size of the incorporated BN particles. In the case of the BN particles, whose specific surface areas were 14.3 m2/g and 11 m2/g (average particle size: 1 μm and 5 μm, respectively), the highest thermal conductivity was observed at 3.0 wt% and 2.5 wt% of the silane compatibilizer, respectively. By converting the particle size and specific surface area into the shape factor, the optimal amount of amino silane required to maximize the thermal conductivity was discussed in relation with the interphase structure and thermal resistance.
- Berman R, Contemp. Phys., Heat conductivity of non-metallic crystals, 14, 101 (1973)
- Bujard P, Thermal conductivity of boron nitride filled epoxy resins : temperature dependence and influence of sample preparation, Proc. I-THERM, Los Angles, May 11-13 IEEE, 41. (1998)
- Droval G, Feller JF, Salagnac P, Gluoannec P, Polymers for Advanced Technologies., Thermal conductivity enhancement of electrically insulating syndiotactic poly(styrene) matrix for diphasic conductive polymer composites., 17, 732 (2006)
- Fiorilli S, Rivolo P, Descrovi E, Ricciardi C, Pasquardini L, Lunelli L, Vanzetti L, Pederzolli C, Onida B, Garrone E, J. Colloid Interface Sci., 321(1), 235 (2008)
- Hsieh CY, Chung SL, J. Appl. Polym. Sci., 102(5), 4734 (2006)
- Hubaek M, Ueki M, Journal of Solid State Chemistry., 123, 215 (1996)
- Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)
- Kameshima Y, Kuramochi S, Yasumori A, Okada K, Journal of the Ceramic Society of Japan., Analysis of surface state and stability during storage of AlN powders by X-ray photoelectron spectroscopy, 106(8), 749 (1998)
- Lee GW, Park M, Kim J, Lee JI, Yoon HG, Composites: Part A., Enhanced thermal conductivity of polymer composites filled with hybrid filler, 37, 727 (2006)
- Li J, Nakamura M, Shirai T, Matsumaru K, Ishizaki C, Ishizaki K, Advances in Technology of Materials and Materials Processing., Hydrolysis of Aluminum nitride powders in moist air, 7(1), 37 (2005)
- Nagai Y, Lai G, Journal of the Ceramic Society of Japan., Thermal conductivity of epoxy resin filled with particulate aluminum nitride powder, 105(3), 197 (1997)
- Nielsen LE, Ind. Eng. Chem. Fund., The thermal and electrical conductivity of two-phase systems, 13(1), 17 (1974)
- Progelhof RC, Throne JL, Ruetsch RR, Polymer Engineering and Science., Methods for predicting the thermal conductivity of composites systems: A review, 19(9), 615 (1976)
- Yung KC, Zhu BL, Wu J, Yue TM, Xie CS, J. Polym. Sci. B: Polym. Phys., 45(13), 1662 (2007)
- Yung KC, Liem H, J. Appl. Polym. Sci., 106(6), 3587 (2007)
- Yung KC, Wu J, Yue TM, Xie CS, Journal of Composite Materials., Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate, 40(7), 567 (2007)
- Xie SH, Zhu BK, Li JB, Wei XZ, Xu ZK, Polymer Testing., Preparation and properties of polyimide/aluminum nitride composites, 23, 797 (2004)
- Xu YS, Chung DDL, Compos. Interfaces, Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxymatrix composites by particle surface treatments, 7(4), 243 (2000)
- Xu Y, Chung DDL, Mroz C, Composites Part A., Thermally conducting aluminum nitride polymer-matrix composites, 32, 1749 (2001)