Electrodeposition of 05 pm thick CoxFe(1-x) (x=0 33-0 87) films was carried out from a sulfate/chloride plating solution containing sacchai in as an organic additive at constant current density and a corm oiled pH 23 The increase of Fe2+ concentrations in plating solution resulted in an increase of Fe-content and tensile stress in CoxFe1-x films which is accompanied by a decrease of plating rate Several possible origins for generation of tensile stress include the following interfacial stress between CoFe films and Cu-substrate crystal texture and grain size coalescence and stress evolution during film growth and hydrogen adsorption/desorption The adsorption/desorption mechanism of hydrogen seems to be the most likely dominant stress mechanism The relationship between Increase of the tensile stress and decrease of plating rate was discussed (C) 2010 Published by Elsevier Ltd