The need for higher pool boiling critical heat flux (CHF) in electronic cooling applications has turned attention to the use of binary mixtures of dielectric liquids. The available literature demonstrates that the addition of a liquid with higher saturation temperature, higher molecular weight, higher viscosity and higher surface tension can lead to significant enhancement of CHF, beyond what can be achieved through changes in pressure, liquid subcooling, and the product of surface effusivity and heater thickness. The current study focuses on extending the available data on mixture CHF enhancement, as well as pool boiling, on polished silicon surfaces to FC-72/FC-40 mixture ratios of 10%, 15%. and 20% of FC-40 by weight, a pressure range of between 1 and 3 atm, and fluid temperature from 22 to 45 degrees C, leading to high subcooling conditions. It is found that peak heat flux can be increased to as high as 56.8 W/cm(2) compared to 25.2 W/cm(2) for pure FC-72 at 3 atm and 22 degrees C. It is believed that the increase in the mixture latent heat of evaporation and surface tension, accompanying the depletion of the lower boiling point fluid in the wall region plays the major role in enhancing the critical heat flux for binary mixtures. (C) 2010 Elsevier Ltd. All rights reserved.