Journal of Applied Polymer Science, Vol.117, No.5, 2932-2936, 2010
Thermal Properties of New Bismaleimide Resins Containing Hydrogen Silsesquioxane and Diallyl Bisphenol A
Bismaleimide (BMI) resins modified with hydrogen silsesquioxane (HSQ) and diallyl bisphenol A (DABPA) (BMI-HSQ-DABPA resins) were prepared. DSC, FTIR, and TGA were used to characterize the curing behaviors, structures, and thermal properties of the BMI-HSQ-DABPA resins, respectively. The results showed that the glass transition temperatures and thermal stabilities of the cured BMI-HSQ-DABPA resins increased with the rise of the contents of HSQ. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 117: 2932-2936, 2010
Keywords:modified bismaleimide resin;hydrogen silsesquioxane;diallyl bisphenol A;thermal properties;high performance resin