An analytical thermal resistance network model is developed for calculating mean die temperature of a typical BGA packaging. The thermal resistance network is established based on heat dissipation paths from die to ambient. Every thermal resistance in the network can be calculated by analytical expressions. The proposed model is applied to a typical BGA packaging. Simulations to obtain the die temperature of the packaging were also done by COMSOL. The data comparison shows that the mean die temperatures calculated by the present model are very close to the ones obtained by simulations. It is demonstrated that the proposed model can be used to predict the mean die temperature of BGA packaging accurately. This proposed model is simple and resource-saving for the semi-conductor industry to predict the mean die temperature of typical BGA packaging and also it provides an optimization method to choose materials for good thermal management of BGA packaging. (C) 2010 Elsevier B.V. All rights reserved.