폴리(에틸렌 테레프탈레이트)/폴리(에틸렌 나프탈레이트) 공중합체의 유연기판 특성

염주선; 김재현; 강호종; Joo Sun Youm; Jeahyun Kim; Ho-Jong Kang

Polymer(Korea), Vol.35, No.6, 599-604, November, 2011

Export Citation

폴리(에틸렌 테레프탈레이트)/폴리(에틸렌 나프탈레이트) 공중합체의 유연기판 특성

Characteristics of PET-PEN Copolymer as a Material for Flexible Substrate

염주선, 김재현, 강호종 ^†

단국대학교 광 에너지 소재 연구센터, 고분자시스템공학과

Joo Sun Youm, Jeahyun Kim, and Ho-Jong Kang^†

Center for Photofunctional Energy Materials, Dept. of Polymer Science and Engineering, Dankook University, 126 Jukjeon-dong, Sugi-ku, Yongin-si, Gyeonggi-do 448-160, Korea

E-mail:

초록

폴리에스테르 유연기판 제조를 위하여 PET-PEN 공중합체를 합성하고 이들의 형태학적 변화가 유연기판 특성에 미치는 영향을 살펴보았다. 합성된 PET-PEN 공중합체는 DMT/NDC의 조성비에 따라 공중합체 block sequence가 달라짐을 확인하였다. 공중합체에 PET-PEN과 PEN의 block sequence가 증가할수록 유리전이온도가 증가하며 이에 따라 유연기판의 치수안정성이 증가됨을 확인하였으며 DMT/NDC의 조성비가 50/50인 경우, 열팽창계수(CTE)가 최소가 됨을 확인하였다. 합성된 PET-PEN 공중합체는 광투과 특성이 80% 이상을 유지하며 1시간 동안 280 ℃에서의 열안정성도 0.4 wt% 이내를 유지하여 유연기판으로 적용이 가능함을 알 수 있었다.

The PET-PEN copolymers have been synthesized and the effect of their morphology on the physical properties of polyester flexible substrate was investigated. It was found that the block sequence of synthesized copolymer was varied depending upon DMT/NDC ratio in polymerization. Higher PETPEN and PEN block sequence in polyester copolymer resulted in the increase of glass transition temperature and it caused the enhancement of dimensional stability as a polyester flexible substrate. The highest coefficient of thermal expansion(CTE) was obtained when DMT/NDC ratio is 50/50. Synthesized PET-PEN copolymer seems to be acceptable as a flexible substrate since it shows that their optical transmittance at 550 nm is over 80% and thermal weight loss at 280 ℃ for 1 hr is less than 0.4 wt%.

Keywords:poly(ethylene terephthalate)/poly(ethylene naphthalate) copolymer;copolymer block sequence;glass transition temperature;flexible substrate;coefficient of thermal expansion.

[References]

Crawford GP, Flexible flat panel display technology, New York, Wiley (2005)
Lee J, Hwang DK, Choi JM, Lee K, Kim JH, Im S, Park JH, Kim E, Appl. Phys. Lett., 87, 023504 (2005)
Nathan A, Chalamala BR, Special Issues on Flexible Electronics Technology, Proceedings of the IEEE., 93, 1235 (2005)
MacDonald WA, Rollins K, Eveson R, Rustin RA, Handa M, SID Dig., 34, 264 (2003)
Ishikawa M, Polymer, 36(11), 2203 (1995)
Toyota A, Yamaguchi M, Polym. Mater. Sci. Eng., 76, 24 (1997)
Kwon Y, Im H, Kim JH, Polym.(Korea), 34(1), 1 (2010)
Porter RS, Wang LH, Polymer., 33, 2019 (1992)
Andresen E, Zachmann G, Colloid Polym. Sci., 272, 1352 (1994)
Suzuki M, U. S. Patent 5,837,800 (1998)
Tyan HL, Liu YC, Wei KH, Chem. Mater., 11, 1942 (1999)
Chun YS, Han YS, Hyun JC, Kim WN, Polymer, 41(24), 8717 (2000)
Agag T, Koga T, Takeichi T, Polymer, 42(8), 3399 (2001)
Beecroft LL, Ober CK, Chem. Mater., 9, 1302 (1997)

[Related Articles]

[1] Crawford GP, Flexible flat panel display technology, New York, Wiley (2005)

[2] Lee J, Hwang DK, Choi JM, Lee K, Kim JH, Im S, Park JH, Kim E, Appl. Phys. Lett., 87, 023504 (2005)

[3] Nathan A, Chalamala BR, Special Issues on Flexible Electronics Technology, Proceedings of the IEEE., 93, 1235 (2005)

[4] MacDonald WA, Rollins K, Eveson R, Rustin RA, Handa M, SID Dig., 34, 264 (2003)

[5] Ishikawa M, Polymer, 36(11), 2203 (1995)

[6] Toyota A, Yamaguchi M, Polym. Mater. Sci. Eng., 76, 24 (1997)

[7] Kwon Y, Im H, Kim JH, Polym.(Korea), 34(1), 1 (2010)

[8] Porter RS, Wang LH, Polymer., 33, 2019 (1992)

[9] Andresen E, Zachmann G, Colloid Polym. Sci., 272, 1352 (1994)

[10] Suzuki M, U. S. Patent 5,837,800 (1998)

[11] Tyan HL, Liu YC, Wei KH, Chem. Mater., 11, 1942 (1999)

[12] Chun YS, Han YS, Hyun JC, Kim WN, Polymer, 41(24), 8717 (2000)

[13] Agag T, Koga T, Takeichi T, Polymer, 42(8), 3399 (2001)

[14] Beecroft LL, Ober CK, Chem. Mater., 9, 1302 (1997)