3D Analysis of Heat Transfer Intensification by Re-Entrance Flow Pin-Fins Microstructures with a Highly Thermal-Conductive Plate (vol 34, pg 379, 2011)

Wang Q; Hessel V; Rebrov EV; Werner B

Chemical Engineering & Technology, Vol.34, No.5, 658-658, 2011

DOI10.1002/ceat.201190027 Export Citation

3D Analysis of Heat Transfer Intensification by Re-Entrance Flow Pin-Fins Microstructures with a Highly Thermal-Conductive Plate (vol 34, pg 379, 2011)

Wang Q, Hessel V, Rebrov EV, Werner B