Carbon nanotube reinforced copper (CNT/Cu) nanoplatelets were developed by a simple two-step deposition method; thermal vapor deposition of Cu and anodic eletrophoretic deposition of CNT. Due to the fast corrosion during the electrophoresis, the Cu layer is broken into pieces and exfoliated to form the platelet structures. Consequently, highly conductive and strong CNT/Cu nanoplatelets are effectively built-up. When applied in carbon fiber composites, the CNT/Cu nanoplatelets significantly enhanced both interlaminar shear strength and electrical conductivity comparing to baseline composites. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3582354] All rights reserved.