화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Applied Chemistry for Engineering, Vol.23, No.3, 313-319, June, 2012
Export Citation
구리도금된 탄소섬유/에폭시 수지 복합재료의 기계적 계면 특성에 관한 연구
A Study on Mechanical Interfacial Properties of Copper-plated Carbon Fibers/Epoxy Resin Composites
홍명선1, 2, 배경민3, 최웅기1, 이해성2, †, 박수진3, 안계혁1, 김병주1, †
  • 1전주기계탄소기술원 탄소밸리사업단
  • 2전주대학교 나노신소재과
  • 3인하대학교 화학과
Myung-Sun Hong1, 2, Kyong-Min Bae3, Woong-Ki Choi1, Hae-Seong Lee2, †, Soo-Jin Park3, Kay-Hyeok An1, and Byung-Joo Kim1, †
  • 1Carbon Valley R&D Division, Jeonju Institute of Machinery and Carbon Composites, Jeonju 561-844, Korea
  • 2Department of Nano Advanced Materials Engineering, Jeonju University, Jeonju 560-759, Korea
  • 3Department of Chemistry, Inha University, Incheon 402-751, Korea
E-mail:,
초록
본 연구에서는 Polyacrylonitrile (PAN)계 탄소섬유 표면에 구리도금 표면처리가 탄소섬유 강화 복합재료의 기계적 계면 특성에 미치는 영향에 관하여 관찰하였다. 탄소섬유 표면특성은 주사전자현미경, X-선 광전자 분광법, X-선 회절분석기, 접촉각 측정기로 측정하였고, 탄소섬유 강화 복합재료의 기계적 계면 물성은 층간전단강도(interlaminar shear strength, ILSS)와 파괴인성(critical stress intensity factor, KIC)측정을 통하여 알아보았다. 실험결과로부터, 기계적 계면물성은 탄소섬유 표면에 COOH group과 도금된 구리함량이 증가됨에 따라 순차적으로 증가되는 것이 확인되었으나, 도금시간을 길게 하여 과량의 구리가 도입되었을 경우 기계적 계면 물성을 도리어 감소시키는 것으로 확인되었다. 결론적으로 구리함량이 탄소섬유 복합재료의 기계적 계면물성을 결정하는 중요 요소라 판단되나, 최적의 함량이상에 서는 계면분리에 의한 물성저하의 원인이 될 수 있다.
In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor (KIC). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.
Keywords:Cu plating;carbon fibers;interlaminar shear strength;critical stress intensity factor;carbon fibers-reinfo plastics
  1. Montes-moran MA, Young RJ, Carbon., 40, 857 (2002)
  2. Schwartz MM, Composite Materials Handbook, 2nd ed., McGraw-Hill, New-York (1992)
  3. Davis DC, Wikerson JW, Zhu J, Ayewah DOO, Compos. Struct., 92, 2653 (2010)
  4. Park SJ, in Interfacial Forces and Fields: Theory and Applications, ed. By J. P. Hsu, chap. 9, Marcel Dekker, New York (1999)
  5. Bortz DR, Merino C, Martin-Gullon I, Comp. Part A :Appl. Sci. Manuf., 42, 1584 (2011)
  6. Zhiwei X, Yudong H, Yuanjun S, Chunhua Z, Li L, J.Rare Earths., 25, 462 (2007)
  7. Park SJ, Kim MH, Choi S, Lee JR, Polym.(Korea), 24(4), 499 (2000)
  8. Park SJ, Seo MK, Lee DR, Carbon., 41, 2991 (2003)
  9. Jincheng X, Hui Y, long X, Xiaolong L, Hua Y, AAPG Bull., 25, 489 (2004)
  10. Rams J, Urena A, Escalera MD, Sanchez M, Comp. Part A: Appl., 38, 566 (2007)
  11. Kim KS, Park SJ, Carbon Lett., 1, 51 (2012)
  12. Park SJ, Jang YS, Kawasaki J, HWAHAK KONGHAK, 40(6), 664 (2002)
  13. Park SJ, Jang YS, Lee JR, Kim JS, Polym.(Korea), 24(5), 721 (2000)
  14. Hage E, Costa SF, Pessan LA, J. Adhes. Sci. Technol., 11(12), 1491 (1997)
  15. Anirudhan TS, Suchithra PS, J. Ind. Eng. Chem., 16(1), 130 (2010)
  16. Qu XF, Zheng JT, Zhang YZ, J. Colloid Interface Sci., 309(2), 429 (2007)
  17. Ko KR, Yang BH, Ryu SK, HWAHAK KONGHAK, 41(3), 307 (2003)
  18. Fukunaga A, Ueda S, Composites Sci. & Tech., 60, 249 (2000)
  19. Xie J, Xin D, Cao H, Wang C, Zhao Y, Yao L, Ji F, Qiu Y, Surface & Coatings Technology., 206, 191 (2011)
  20. Dilsiz N, Wightman LP, Carbon., 37, 1105 (1999)
  21. Charrier JM, Polymeric Materials and Processing, Hanser, Munich (1990)
  22. Park SJ, Kim BJ, Rhee JM, Polym.(Korea), 27(3), 235 (2003)
  23. Park SJ, Lee JR, J. Mater. Sci., 33(3), 647 (1998)
  24. Abraham S, Pai BC, Satyanarayana KG, Vaidyan VK, J. Mater, Sci., 25, 2839 (1990)
  25. Lantelme F, Seghiouer A, Derja A, J. Appl. Electrochem., 28(9), 907 (1998)
  26. KimuraT, Ishiguro A, Andou A, Fujita K, J. Power Soures., 85, 149
  27. Gardner SD, Singamsetty CSK, Booth GL, He GR, Pittman CU, Carbon., 33, 587 (1995)
  28. Park SJ, Jang YS, J. Colloid Interface Sci., 263(1), 170 (2003)
  29. Kim BK, Ryu SK, Kim BJ, Park SJ, J. Colloid Interface Sci., 302(2), 695 (2006)
  30. Park SJ, Kim MH, Lee JR, Choi S, J. Colloid Interface Sci., 228(2), 287 (2000)
  31. Park SJ, Kim TJ, Lee JR, Hong SK, Kim YK, Polym.(Korea), 24(3), 326 (2000)
  32. Park SJ, Oh JS, Suh DH, J. Korean Ind. Eng. Chem., 14(5), 586 (2003)
  33. Park SJ, Oh JS, Suh DH, Korean Chem. Eng. Res., 42(1), 102 (2004)
  34. Rho SB, Lim MA, Polym.(Korea), 23(5), 662 (1999)
  35. Hameed N, Thomas SP, Abraham R, Thoams S, Express.Polym. Lett., 1, 345 (2007)
  36. Chibowski E, Perea-Carpio R, Adv. Colloid Interface Sci., 98, 245 (2002)
  37. Park SJ, Seo MK, Rhee KY, Mater. Sci. Eng., 356, 219 (2003)
  38. Fukunaga A, Ueda S, Nagumo M, J. Mater. Sci., 34(12), 2851 (1999)