The electrodeposition of copper from industrial sulphate electrolytes has been studied using electrochemical impedance spectroscopy on the gold disc ultramicroelectrode. The influence of dc potential E (dc) , temperature, cupric ions and animal glue concentration on electrochemical impedances has been investigated. The mechanism of the copper electro-reduction process in industrial electrolytes has been proposed and experimental impedance data have been analyzed by proper equivalent circuits. According to our knowledge the faradaic and non-faradaic impedance parameters of the process on ultramicroelectrode's have been estimated for the first time in complex matrix copper industrial electrolytes. The role of animal glue in copper industrial electrolytes has been discussed in the present paper.