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Journal of the Electrochemical Society, Vol.158, No.10, H1034-H1040, 2011
Metal Reaction Doping and Ohmic Contact with Cu-Mn Electrode on Amorphous In-Ga-Zn-O Semiconductor
We investigated the microstructure and electrical properties of Cu and Cu-Mn alloy on amorphous In-Ga-Zn-O (a-IGZO) oxide semiconductor in order to explore a high performance electrode material for thin film transistors (TFTs) in advanced flat panel displays. Current-voltage measurements of metal/semiconductor contact structure showed a non-linear behavior with Cu, while a good ohmic behavior [rho(C) = (1.2-2.9) x 10(-4) Omega.cm(2)] with the Cu-Mn alloy after annealing at 250 degrees C for 1 h. Transfer and output characteristics of TFT structure also showed excellent performance with the Cu-Mn alloy. The good electrical property was due to the formation of a highly doped n(+) a-IGZO layer with the carrier density of 1.4 x 10(20) cm(-3). The donor doping could be achieved simply by heat treatment to promote the oxidation of Mn and the reduction of a-IGZO. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3621723] All rights reserved.
Keywords:amorphous semiconductors;annealing;carrier density;copper alloys;crystal microstructure;flat panel displays;gallium compounds;II-VI semiconductors;indium compounds;manganese alloys;ohmic contacts;oxidation;semiconductor doping;semiconductor-metal boundaries;thin film transistors;zinc compounds