화학공학소재연구정보센터
Applied Surface Science, Vol.258, No.4, 1399-1404, 2011
Surface microstructures and antimicrobial properties of copper plasma alloyed stainless steel
Bacterial adhesion to stainless steel surfaces is one of the major reason causing the cross-contamination and infection in many practical applications. An approach to solve this problem is to enhance the antibacterial properties on the surface of stainless steel. In this paper, novel antibacterial stainless steel surfaces with different copper content have been prepared by a plasma surface alloying technique at various gas pressures. The microstructure of the alloyed surfaces was investigated using glow discharge optical emission spectroscopy (GDOES) and scanning electron microscopy (SEM). The viability of bacteria attached to the antibacterial surfaces was tested using the spread plate method. The antibacterial mechanism of the alloyed surfaces was studied by X-ray photoelectron spectroscopy (XPS). The results indicate that gas pressure has a great influence on the surface elements concentration and the depth of the alloyed layer. The maximum copper concentration in the alloyed surface obtained at the gas pressure of 60 Pa is about 7.1 wt.%. This alloyed surface exhibited very strong antibacterial ability, and an effective reduction of 98% of Escherichia coli (E. coli) within 1 h was achieved by contact with the alloyed surface. The maximum thickness of the copper alloyed layer obtained at 45 Pa is about 6.5 mu m. Although the rate of reduction for E. coli of this alloyed surface was slower than that of the alloyed surface with the copper content about 7.1 wt.% over the first 3 h, few were able to survive more than 12 h and the reduction reached over 99.9%. The XPS analysis results indicated that the copper ions were released when the copper alloyed stainless steel in contact with bacterial solution, which is an important factor for killing bacteria. Based on an overall consideration of bacterial killing rate and durability, the alloyed surface with the copper content of 2.5 wt.% and the thickness of about 6.5 mu m obtained at the gas pressure of 45 Pa is expected to be useful as antimicrobial materials that may have a promising future in antimicrobial applications. (C) 2011 Elsevier B.V. All rights reserved.