Copper was directly deposited on a polymer substrate whose surface is coated with a palladium nanoparticle/silica nanoparticle/acrylic polymer hybrid layer. On the surface of the hybrid, the palladium nanoparticles function as a catalyst for the electroless copper deposition, and the nanometer-scale roughness, which is due to the silica nanoparticles, increases the adhesion between the polymer and copper.