High-conductivity graphite foam is investigated for use as a surface enhancement for improved thermal performance in both pool boiling and an FC-72 thermosyphon. The influences of heat load and fluid level on the overall system thermal performance including surface superheat, effective heat transfer coefficient, and thermal resistance are examined. The thermal resistance of the foam heat sink is found to be extremely low at a minimum of 0.024 K/W, well below that of many other methods. The featured low thermal resistance is the primary benefit of this system. The thermal resistance is found to rise with increasing heat flux, but still remains advantageously low and exhibits excellent potential for high heat flux dissipation with low surface superheat, making it suitable for thermal management of advanced electronics.