화학공학소재연구정보센터
번호 제목
32 Chemical Mechanical Polishing and Electrochemical Characterization of Tungsten by Using Mixed Oxidizers
허철준, 전석진, 소재현, 양승만
한국화학공학회 2006년 가을 학술대회
31 Effects of Organic Additives in Ceria Slurry on Enhanced Oxide-to-Nitride Removal Selectivity in Shallow Trench Isolation Chemical Mechanical Polishing
Byeong-Seog LEE, Hyun-Goo KANG, Kyung-Woong PARK, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 가을 학술대회
30 Effect of Alkaline Agent in Colloidal-Silica Slurry on Polysilicon Chemical-Mechanical Polishing Process.
Keum-Seok PARK, Myoung-Yoon LEE, Hyung-Soon PARK, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 가을 학술대회
29 Effects of Surfactant Molecular weight and Concentration in Nano-Ceria Slurry on Nanotopography Impact in Chemical Mechanical Polishing
Hyuk-Yul CHOI, Hyun-Goo KANG, Jun-Seok KIM, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 가을 학술대회
28 MOCVD를 이용한 SiO2 나노 입자상의 CeO2 박막 증착
안재희, 이관영
한국화학공학회 2006년 봄 학술대회
27 Effects of Amorphous-silicon and Poly-silicon films on Within-Wafer Non-Uniformity (WIWNU) Improvement in Chemical Mechanical Polishing.
Yoon-Kweon Choi, Jae-Il Choi, Kyung-Woong PARK, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 봄 학술대회
26 Reduction of Large Particles and Light Point Defects (LPD) by Aging and Selective Sedimentation Process in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
Byong-Seog Lee, Hyun-Goo Kang, Kyung-Woong Park, Ungyu Paik, Jea-Gun Park
한국재료학회 2006년 봄 학술대회
25 Effects of Non-Prestonian Behavior of Ceria Slurry with Anionic Surfactant on Abrasive Concentration and Size in Shallow Trench Isolation Chemical Mechanical Polishing
Hyuk-Yul CHOI, Hyun-Goo KANG, Jun-Seok KIM, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 봄 학술대회
24 Influence of Bead Size during Ceria Abrasive Milling Process on High Selectivity and Light Point Defect (LPD) Formation after STI-CMP
MOON Seung-Hyun, LEE Keun-Hoo, KIM Jun-Seok, KANG Hyun-Goo, PAIK Ungyu, PARK Jea-Gun
한국재료학회 2006년 봄 학술대회
23 Conditioner disk의 diamond의 형상에 따라 Polishing Pad에 미치는 영향
김규채, 강영재, 유영삼, 박진구, 원영만, 오광훈
한국재료학회 2006년 봄 학술대회