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Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles Eun Jung Lee, Sang-Jin Oh, Yejin Jo, Sun Sook Lee, Young Hun Kang, Hye-Ji Jeon, Song Yun Cho, Jin-Seong Park, Yeong-Hui Seo, Tae-Gon Kim, Beyong-Hwan Ryu, Youngmin Choi, Su Yeon Lee, Sunho Jeong 한국재료학회 2015년 봄 학술대회 |