| 학회 |
한국고분자학회 |
| 학술대회 |
2021년 가을 (10/20 ~ 10/22, 경주컨벤션센터) |
| 권호 |
46권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process |
| 초록 |
The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs, Si NM diodes, and p-channel silicon MOSFETs. Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others. |
| 저자 |
이수언, 진호준, 성한상, 고영천, 박준현, 정민규, 김봉훈
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| 소속 |
숭실대 |
| 키워드 |
buckling process; 3D structures; silicone elastomer; microfabrication; 2D structures.
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| E-Mail |
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