| 초록 |
In this study, epoxy resins/nano-SiC composites were prepared by melt blending of diglycidylether of bisphenol-A (DGEBA) and nano-SiC particles. The content of nano-SiC was varied from 0 to 15 wt%, and 4,4'-diaminodiphenyl methane (DDM) was used as a curing agent. The curing behavior, thermal stability, and dynamic mechanical properties of the composites were investigated using a differential scanning calorimetry (DSC), a thermogravimetric analysis (TGA), and a dynamic mechanical analysis (DMA). As a result, the curing peak temperature of the composites was decreased with increasing nano-SiC content. The thermal stability of the composites was similar to that of the neat epoxy resins. The glass transition temperature and storage modulus of the composites were increased by the addition of nano-SiC. |
