| 학회 |
한국공업화학회 |
| 학술대회 |
2021년 봄 (05/12 ~ 05/14, 부산 벡스코(BEXCO)) |
| 권호 |
25권 1호 |
| 발표분야 |
포스터-도료·코팅 |
| 제목 |
Study on Synthesis of Novel Polyamideimide Copolymer for Flexible Coverlay |
| 초록 |
Owing to its flexibility, light-weight and form factor, a flexible printed circuit board (FPCB) with a structure of coverlay/copper patterns/PI substrate has been widely used for manufacturing portable electronics. In general, coverlay consists of two layers of a PI film and an epoxy layer and its thickness reaches about 20 um. Recently, thinner thickness is required for thin filmization of FPCB. In this work, polyamidemide containing polyurethane backbone was synthesized and admixed with an epoxy resin to produce an ink for manufacturing a thin coverlay. The mechanical durability and thermal stability of the fabricated coverlay were investigated. |
| 저자 |
김정아1, 김보영2, 박성대2, 김영민2, 서지훈1, 유명재2
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| 소속 |
1고려대, 2한국전자기술(연) |
| 키워드 |
Coverlay ink; Flexibility; Polyamideimide
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| E-Mail |
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