| 초록 |
Copper electrodeposition for microvia filling has been used to build high density interconnect (HDI) printed circuit boards. In microvias filling, defect-free and seam-less filling should be achieved to ensure the reliability of interconnections. Leveler is the organic additive added in the electrodeposition for homogeneous surface development in microvias. The effects of leveler structure on its inhibition ability have been reported in recent studies and studying the structure-property relationship of the leveler would be important to get better understanding of the inhibition mechanisms and for future design of levelers. In this study, we have synthesized triethylene glycol (TEG)-based levelers with different terminal groups. The TEG-based levelers we devised consist of functional groups that showed several effective features in Cu2+ reduction, which will be reported. Finally, the structure-property relationship of these levelers was investigated with some electrochemical analyses. |
