| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 가을 (10/09 ~ 10/10, 일산킨텍스) |
| 권호 |
33권 2호 |
| 발표분야 |
고분자 합성 |
| 제목 |
The effect of diamine composition change in aromatic polyimide films for low CTE and low moisture absorption |
| 초록 |
Aromatic polyimides are widely used for the substrate of the microelectronic packaging applications such as flexible printed circuit (FPC), chip on film (COF) and tape automated bonding (TAB). In these applications, polyimides are employed as flexible substrates for the metallization of copper. However, polyimide films have much higher coefficient of thermal expansion (CTE) values in the film plane direction than those of copper metal layer. Also, despite the relatively high chemical resistance characteristics, polyimides still absorb moisture. In order to investigate the effect of the composition of diamine components on the CTE value, polyimides were synthesized by varying the ratio of rigid diamine to flexible diamine in combination with dianhydride. The CTE value, moisture absorption property and mechanical properties of various polyimide films will be discussed. |
| 저자 |
박윤준1, 이준혁1, 최종호1, 김석제1, 안정호2, 홍영택1
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| 소속 |
1한국화학(연), 2성균관대 |
| 키워드 |
polyimide films; low CTE; low moisture absorption
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| E-Mail |
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