| 초록 |
Generally, polyimides are used as interlayer dielectrics in microeletronics applications by simple spin-coating techniques. One approach to the preparation of porous, low-k polyimide is through the creation of voids by thermal degradation of the template of polyimide / polyethylene oxide-co- polypropylene oxide-co-polyethylene oxide (F127) composites. In this study, porous polyimide films were prepared using multistep curing and calcination. Poly (amic acid) (PAA) was synthesized from pyromellitic dianhydride (PMDA) and oxydiphenylenediamine (ODA). And the porous polyimide films were prepared by the PAA. The porous polyimide films were characterized by IR spectra. The properties of porous polyimide films were characterized by UV-vis transmission spectra, dielectric constant, amall angle X-ray scattering(SAXS) and scanning electron nicroscopy(SEM). |
