| 학회 |
한국고분자학회 |
| 학술대회 |
2021년 가을 (10/20 ~ 10/22, 경주컨벤션센터) |
| 권호 |
46권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Mechanically Guided Post-Assembly of 3D Electronic Systems |
| 초록 |
This paper describes assembly processes for transforming conventional, planar devices based on FPCB platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The mechanical tunability of the resulting 3D FPCB platforms allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components. |
| 저자 |
선승원, 고정흔, 성한상, 오영택, 황준표, 박신, 김봉훈
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| 소속 |
숭실대 |
| 키워드 |
Multifunctional Electronic System; Mechanically Guided Geometry Transformation; Flexible Printed Circuit Board Platform; 3D Structure Assembly Process; 3D Elastic Deformatio
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| E-Mail |
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