| 학회 |
한국공업화학회 |
| 학술대회 |
2013년 봄 (05/01 ~ 05/03, ICC JEJU) |
| 권호 |
17권 1호 |
| 발표분야 |
포스터-나노 |
| 제목 |
Polishing of sapphire wafer using SiO2/diamond mixed abrasive slurry |
| 초록 |
Sapphire (Al2O3) material has high hardness and inert property on chemicals so that it is known very difficult to polish a sapphire material or wafer. An adoption of large size diamond slurry would help improve the polishing rate but would also leave multiple scratches on the surface of the wafer. In order to increase the polishing rate without leaving multiple scratches, we used a mixture of silica sol slurries with the size of ~50nm and diamond sol with the size of ~100nm. We have obtained that when the concentration of the diamond slurry was 0.625 wt% the polishing rate was at its maximum, whereas at higher levels of concentration we saw a decrease in the polishing rate of the sapphire wafer. This may indicate that nano-diamond acts as a lubricant. |
| 저자 |
이동현, 조경숙, 김대성, 이승호
|
| 소속 |
한국세라믹기술원 |
| 키워드 |
CMP; sapphire; silica; diamond; slurry
|
| E-Mail |
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