| 초록 |
The addition of high component thermally conductive fillers to polymer matrix to form 3D network structures is an effective way to increase the thermal conductivity of polymer matrix composites. Because of its low cost, promising thermal conductivity and insulating properties, alumina is now used as an efficient filler to increase the thermal conductivity of polymer matrix composites. In fact, there is a lot of phonon scattering between the filler-filler and the filler-polymer matrix, the composite's thermal conductivity only increases slightly. In this article, we coated a polypyrrole on the alumina surface using a vapor phase polymerization process, then mixed into the polymer to form a 3D network structure with the epoxy resin. Because of the covalent linkage between the polypyrrole and the polymer matrix, phonon scattering is minimized, allowing the filler to dispersed more evenly across the polymer matrix and thereby increasing the thermal conductivity of the polymer composite. |
