| 초록 |
Due to the miniaturization of electronic devices, it has become important to increase the heat dissipation performance of the lightweight nanocomposite. The thermal conductivity of nanocomposite is improved by increasing the degree of alignment and aggregation that changes in the free pathway of phonon. Herein, we fabricate nanocomposite using molecules as fillers that can aggregate into H-type and J-type. We also find that these fillers can induce a change in the alignment of the other high conducting filler (h-BN) according to different changes in external pressure that improves the thermal conductivity at each direction. Thus, the reasons for the change of aggregation states by H-and J-type fillers in nanocomposite, and changes in the thermal conductivity with increasing pressure are then discussed. |
