| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
22권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Thermal Properties of Hexagonal Boron nitride in DGEBA Epoxy Resin for Superior Insulating Thermally Conductive Composites |
| 초록 |
The thermal dissipation is a gradually significant area in electronic devices to the performance and reliability of devices because of the rapid changes increasing power density, miniaturizing and functionalizing of the devices. Recently, researchers have shown an increased interesting in the surface modification of the insulating filler to improve the thermal conductivity by enhancing the interfacial interaction of the filler/polymer composites. In this study, the surface modification proceeded to hexagonal boron nitride (h-BN) dispersed by ultra-sonication treatment in hydrogen peroxide. This process produces a BN-OH filler. Subsequently, the BN-OH is functionalized with amino group, the process produces a BN-APTMS filler. The modified fillers each was mixed with bisphenol A diglycidyl Ether (DGEBA), 4-aminophenyl sulfone (DDS) in the thinky mixer and cured by hot-press. The thermal conductivity was measured using a transient plane source method, also called hot disk method. |
| 저자 |
박성원, 강주희, 임종태, 석웅철, 권세진, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
hexagonal boron nitride; surface modification; epoxy resin; thermal conductivity
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| E-Mail |
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