| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
분자전자소재 및 소자 |
| 제목 |
Multilayer formation for barrier coating on plastic substratevia atomic layer deposition and thermal evaporation |
| 초록 |
Flexible passivation multilayer was formed on plastic substrate for barrier property enhancement. Multilayer consists of Al2O3/Ag/Al2O3 on a plastic substrate. Al2O3 layers were successfully deposited on plastic substrates via plasma enhanced atomic layer deposition (PEALD) process using trimethylaluminum (TMA) and oxygen. Ag was deposited by thermal evaporation between Al2O3 layers. The effect Ag layer thickness was examined in terms of barrier properties and ductility of the layer. Increase of Ag layer thickness still much reduced the water vapor transmission rate and enhanced the flexibility of the substrate. Multilayer of Al2O3/Ag/Al2O3 has more stable mechanical properties than the single Al2O3 passivation layer. |
| 저자 |
장정수1, 김현기2, 이종걸1, 김성수1
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| 소속 |
1경희대, 2제일모직 |
| 키워드 |
Al2O3; Barrier coating; Flexible substrate
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| E-Mail |
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