| 학회 |
한국재료학회 |
| 학술대회 |
2008년 가을 (11/07 ~ 11/07, 차세대융합기술연구원) |
| 권호 |
14권 2호 |
| 발표분야 |
반도체재료 |
| 제목 |
Failure Analysis of BGA Test Socket Pins |
| 초록 |
BGA test sockets failed earlier than the expected life-time due to abnormal signal delay, shown especially at the low temperature(-5℃). Failure analysis of failed socket was conducted by EDX, AES, and XRD. The SnO layer contaminated with C was found to form on the surface of socket pins. The formation of SnO layer was attributed to the repeated Sn transfer from BGA balls to pin surface and instant oxidation of fresh Sn. As a result, contact resistance increased and thus induced signal delay. Abnormal signal delay at the low temperature was attributed to the increasing resistivity of Sn oxide with decreasing temperature, as manifested by the resistance measurement of SnO2. |
| 저자 |
Myung-Sik Kim1, Kyoo-Sik Bae2
|
| 소속 |
1Department of Electronic Materials Engineering, 2The Univ. of Suwon |
| 키워드 |
BGA socket; failure analysis; fretting corrosion; SnO; contact resistance
|
| E-Mail |
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