| 학회 |
한국고분자학회 |
| 학술대회 |
2021년 가을 (10/20 ~ 10/22, 경주컨벤션센터) |
| 권호 |
46권 2호 |
| 발표분야 |
고분자합성 |
| 제목 |
Preparation of dual curing adhesive with improved mechanical properties |
| 초록 |
We prepared a dual curing adhesive, consisting of thiol/acrylate/epoxy, with improved adhesion strength. The thiol-acrylate reaction was carried out through photo-curing system, whereas the thiol-epoxy reaction occur in the thermal-curing system. The reaction was achieved using a thiol with 4 functional groups, an acrylate with 2 or 3 functional groups, and an epoxy with 2 functional groups. The structure of the synthesized adhesive was confirmed at each stage of the curing process by FT-IR spectroscopy. The lap-shear and peel strength of the dual-cured adhesive between 2 PC film was measured using a universal testing machine. Furthermore, photo-differential scanning calorimeter was used to confirm the thermal characteristics. The gel fraction was measured to confirm the cure degree of adhesives. Viscosity was also measured for 3 days to check storage stability of adhesives. |
| 저자 |
문석규1, 김해찬1, 김정수1, 박한수2, 김동현1
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| 소속 |
1한국생산기술(연), 2중앙대 |
| 키워드 |
Dual-curing; Adhesion; Lap-shear strength; Peel strength; Storage stability
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| E-Mail |
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