| 학회 |
한국고분자학회 |
| 학술대회 |
2019년 가을 (10/09 ~ 10/11, 제주컨벤션센터) |
| 권호 |
44권 2호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Preparation and Properties of Poly(imide-siloxane)/Al2O3 Composite Films. |
| 초록 |
Recently, electronic devices such as smart applications and laptops are becoming smaller and lighter. To ensure proper the smaller device operation. The resulting unwanted heat from the device must be removed as it will cause breakdowns. Polyimides are widely used in optoelectronics, microelectronics and aerospace industries due to its excellent thermal resistance, mechanical properties and low dielectric constant. In this study, Poly(imide-siloxane) copolymers (PIs) with different siloxane contents were synthesized and used as a matrix material of a PI/Al2O3 composite film. Thermal conductivity, thermal stability, mechanical property, film flexibility and morphology of the PI/Al2O3 composite films were investigated for their application as a heat-dissipating material with different PI/Al2O3 loadings. |
| 저자 |
남경남, 최주영, 진승원, 박형주, 김동민, 정찬문
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| 소속 |
연세대 |
| 키워드 |
polyimide; polysiloxane; aluminum oxide; composite film
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| E-Mail |
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