| 초록 |
It is very common to manufacture copper foil using high current density in real industrial field. However, sharing of research results on the interrelationship between used additives and mechanical properties is very limited. In this study, we studied the initial plating properties of individual additives and the surface of complex additives. At the additives are added individually, copper crystals was converged each other at the additives added more than a certain amount. When chloride ion is added, large crystals are formed on some parts of the surface and small crystals are attached to the formed large crystal surface, showing the shape of the crystals growing. When collagen and JGB are added individually, crystals are formed evenly on the surface rather than at the chloride ion, and crystals are growed star-shaped crystals at the increases amount of addition. It is difficult to form a uniform surface layer when adding additives individually. Therefore, it is necessary to add a combination of additives. When combined chloride ion and MPSA were added, Large crystals of more than 10 μm formed on the surface and were not uniform on the surface. When collagen was added to this compound, Large crystals on the surface disappeared, but a valley was formed on the surface. However, the addition of additional JGB reduced the valley and created a smooth plating layer. When chloride ion, MPSA and collagen of 20 ppm were added in combination, grain size increased by 93.5 % (220 peak) and 172.3 % (311 peak) rather than non-additive condition. The addition of JGB 10 ppm reduced crystal size by 25.0 % on average. |
