| 학회 |
한국재료학회 |
| 학술대회 |
2018년 봄 (05/16 ~ 05/18, 삼척 쏠비치 호텔&리조트) |
| 권호 |
24권 1호 |
| 발표분야 |
A. 전자/반도체 재료 분과 |
| 제목 |
Effect of Current Density on Mechanical Properties of Copper Foil. |
| 초록 |
Electroplated copper has used wiring materials for electronic circuit boards and cathode material for secondary battery. In addition to, which is expanding to materials of construction industry due to production convenience and high competitive price. During the electroplating process, various parameter of electroplating is mechanical properties, surface properties and change in crystal structure of the electroplated layer. To observe changes in properties, a electroplating parameters were applied with Taguchi experimental design method. We analyzed the main effects of various properties for each electroplating parameter of electroplated copper layer. As a result, mechanical properties such as tensile strength and elongation are most affected by current densities in plated parameter. As the current density increases, the size of the crystal grain decreases. resulting in an increase in tensile strength. |
| 저자 |
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
|
| 소속 |
Chonbuk National Univ. |
| 키워드 |
Parameter; Copper Plating; SPS; Current Density; Taguchi Method
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| E-Mail |
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