| 초록 |
With the benefit of electrical, mechanical and thermal properties, low temperature co-fired ceramics (LTCC) becomes more and more accepted for RF modules and microwave circuitry such as Bluetooth and front-end module and wireless lan. And for the multi-layered ceramic devices with embedded passive components, materials using LTCC require the several terms to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental results, the influence of each element on the CTE change can be revealed. |
