| 초록 |
A high power LED package based on LTCC, Multi Layer Ceramic-Metal Package, MLCMP, has been proposed. MLCMP utilizes large scale via slug for heat sink slug whose cross section area is greater than ordinary LED die size, which reaches up to 3 mm2. The via slug along with ceramic body could be built simultaneously at one shot sintering with standard manufacturing process of LTCC and no additional flattening process or post process was needed. In the other hand large scale via slug of MLCMP may result in undesirable defects such as de-lamination, crack or camber. However, those defects could be avoided deliberately managing the fabrication process and sintering process. Especially inner surface coating with low viscosity Ag paste was very effective for preventing the defects. As the result, we have succeeded in establishing robust manufacturing process of MLCMP that endures various reliability tests including repetitive thermal shock test. Transient thermal analysis has revealed that thermal resistance contributed to MLCMP is less than 1.0 K/W. Considering the affordability and design flexibility, we anticipate the proposed MLCMP is not only suitable for high power LED package but also a promising solution for illumination modules. |
