| 학회 |
한국재료학회 |
| 학술대회 |
2015년 가을 (11/25 ~ 11/27, 부산 해운대그랜드호텔) |
| 권호 |
21권 2호 |
| 발표분야 |
A. 전자/반도체 재료 |
| 제목 |
Mechanical and electrical properties of Ag/Sn/Ag backside metal using transient liquid phase bonding |
| 초록 |
Die attach materials are required to have high melting temperatures compared with wire bonding process temperature. Conventional high temperature solder (high Pb alloy and Au-based solder) are very toxic and expensive substances. Thus, they should be replaced eco-friendly and inexpensive materials. The advantage of the transient liquid phase (TLP) bonding is the low bonding process temperature and the high remelting temperature. We conducted die bonding on the alloy 42 lead frame using Ag-Sn binary system by TLP bonding, and then evaluated mechanical and electrical properties. |
| 저자 |
안성진, 신태현, 임종수, 최진석
|
| 소속 |
금오공과대 |
| 키워드 |
transient liquid phase bonding; Pb-free solder; Ag-Sn solder alloy
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| E-Mail |
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