| 초록 |
Polyamide-imide (PAI) is widely used as an insulation material in an enameled wire because of its self-lubrication and high thermal index. To extend its lifetime, self-bonding property on the insulation layer is required where voids between the wires could be filled with its own insulation material, i.e., self bonding property, upon the thermal annealing process. Here we developed a self-bonding PAI prepared from polydimethylsiloxane (PDMS) modification on PAI. Furthermore, to effectively release heat generated from the wire, boron nitride nanosheet (BNNS) was dispersed in the PAI. It is hard to enhance thermal conductivity of the composites due to low interfacial adhesion between BNNS and PAI. BNNS was prepared from exfoliation of hexagonal-BN and surface-modified using silanes for enhancing compatibility to the PAI. Exfoliation and surface modification processes will be shown. And self-bonding properties and thermal conductivity of the BNNS/PDMS-PAI composite will also be presented. |
