| 초록 |
In this work, we describe a simple and effective strategy for the fabrication of thin multi porous network of silver (Ag) layer with a high EMI shielding effectiveness (EMI SE). The multi porous network of Ag were fabricated through simple spray coating of conductive ink containing porous Ag nanoparticles, which were followed by an low energy sintering process to develop the Ag layer with multi porous structure and thickness of only ~10 μm in an average. Despite the thin thickness, Ag layer exhibits high EMI SE, which could be attributed to the nanoporous structures resulting from the porous nanoparticles and pores derived from the packing process. This multiple porous structure leads to an increasing of inner multiple reflections of the electromagnetic waves. Our approach is a suitable EMI shielding method for minimizing tendency of electronics to replace present package-level EMI shielding toward the wide range applications. |
