| 초록 |
Dissolution of semiconducting polymers in typical solvents potentially provides these materials with unique opportunities to acheive the soft electronics with cheaper and simpler manufacturing processes. This opportunity, however, serves as a trade-off when one tries to implement these processes in assembling high-resolution tandem devices, since the as-deposited tandem films would be vulnerable to following solution processes as well as photolithography processes. In this talk, we describe a novel orthogonal semiconducting polymer gel (OSPG), which is capable of remarkably showing chemical and physical reliability during sequential solution-tandem photolithography processes. The resulting structures yielded heterogeneous inter-penetrated polymer networks that are highly tolerant against harsh external stimuli. Consequently, high-resolution patterning and forming of tandem structures of OSPG could be done readily through photolithography with sequential solution and etching processes. |
