| 학회 |
한국고분자학회 |
| 학술대회 |
2013년 봄 (04/11 ~ 04/12, 대전컨벤션센터) |
| 권호 |
38권 1호 |
| 발표분야 |
고분자구조 및 물성 |
| 제목 |
Mechanical Properties and Molecular Structures of Ultralow Dielectrics by Post-treatments |
| 초록 |
The improvement of mechanical properties of the nanoporous low-k materials has been very important issue since 1997. To enhance their mechanical properties, UV and O3 treatments have been applied. In our previous study, O3 treatment at 110 ℃ did not decompose -CH3 bond and UV treatment at 430 ℃ improved the stability of the ULK film. To enhance the mechanical properties and secure the stability of the ULK film, we applied UV to O3 treated ULK film. O3 treatment was very effective in improving reactivity between matrix and porogen and consequently resulted in high crosslink density of nanoporous organosilicates and induced the uniform pore size distribution. UV treatment improved stability of the O3 treated film by reducing residual -OH group and increased Si-O-Si network structures which closely related to mechanical strength. Consequently, their elastic modulus greatly increased from 9.1 GPa to 15.5 GPa after O3/UV treatment. |
| 저자 |
김원기1, 김진옥2, 조성민2, 이희우2
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| 소속 |
1서강대 고분자재료연구실, 2서강대 고분자재료 연구실 |
| 키워드 |
lowk; dielectric constant
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| E-Mail |
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